Package Design and Manufacturing
Ron Molnar is a Senior Consultant with Neokinetics and Executive Director of
AZTechDirect, LLC, a company providing consultant services in the areas of advanced
semiconductor packaging and assembly technology.
He was recently Vice President of Engineering at Tiros Corporation, a manufacturer of
automated, semiconductor equipment used to asemble flip chip integrated circuits. In
1997 as VP of Engineering, he co-founded start-up Abpac Inc., a quick turn, U.S.-based, contract
IC assembler dedicated to the design and assembly of BGA and CSP semiconductor packages,
in Phoenix, AZ. Prior to that, he was VP of Advanced Packaging at Amkor Electronics responsible
for the SuperBGA product line and flip chip BGA development. He has held various engineering
and management positions at Synergy Semiconductor, VLSI Technology, Siemens Components,
Inc., and Monsanto.
Ron received a BSEE degree from the University of California at Berkeley, holds 3 patents and has
co-authored several papers in the area of IC packaging and assembly. He is an active member of the
SMTA, IMAPS, MEPTEC and IEEE societies
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