Semiconductor Packaging and Standardization
Associates - Semiconductor Assembly, Packaging and Standardization Consultants.
Previously, he was the Senior Director of Technical Marketing and Technology Fellow
of Advanced Product Development at Amkor Technology for 19 years. While there
he was responsible for managing design, development and qualification of leaded
of the package and process problems interface between the customers and the factories, and
coordination of standardization activities. He is experienced in managing new package and
process programs into production. He is knowledgeable in packages and technologies such as
PDIPs, PLCCs, QFPs, F/L/TQFPs, SOICs, SOJs, TSOPs, TOs, CER-DIPs, P/BGAs, CSPs, and
College. He guided semiconductor industry direction on JEDEC's BOD as its Vice Chairman, as
Committee Chairman of JEDEC JC11/IEC 11.07 Packaging Outline Standardization Committee,
US Liaison to the joint JEDEC/EIAJ Packaging Outline Standards and Test Methods Working
Group, and US Delegate and Chairman of IEC's TC47 Packaging Outline Committee.
|Process Focused Business Optimization™