IC Package/Process Design and Manufacturing
gained from over 35 years in semiconductor assembly and test to support our clients with
product/process design, engineering and strategic technical management.
group. Later he served off-shore for NSC as Managing Director in both Indonesia and
Shaw was also the VP of Operations for start-up Aptix Corp where he lead the successful market
introduction of a 1024 I/O Flip Chip custom interconnect component.
George has extensive ex-patriot experience (20 years in 6 Southeast Asian countries) as a Managing
Director of assembly and test facilities for both IDM and subcontract companies. Shaw’s positions
have also included senior and executive management positions with Psi Technologies, Inc., Amkor
Technology, Alphatec USA, ASAT, and AIT Hong Kong. He has managed multiple strategic projects,
including new facility design, construction and activation and has effected corporate
performance/quality improvements throughout his career.
Although many of his achievements have been at the corporate level, George has maintained a close
association with the technical aspects of Package and Assembly Process Engineering. He has
specified design, materials, process and equipment requirements for QFN, BGA, MEMS and Multi-
Chip packages and developed package design rules and roadmaps for several categories of device
Mr. Shaw holds a BSME from Cal Poly and has completed Executive Development study at Stanford
University and The University of Singapore.
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